- All sections
- H - Electricity
- H05K - Printed circuits; casings or constructional details of electric apparatus; manufacture of assemblages of electrical components
- H05K 3/02 - Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
Patent holdings for IPC class H05K 3/02
Total number of patents in this class: 1125
10-year publication summary
|
132
|
108
|
93
|
101
|
85
|
108
|
81
|
55
|
47
|
20
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| JX Nippon Mining & Metals Corporation | 1576 |
35 |
| Avary Holding (Shenzhen) Co., Limited. | 275 |
25 |
| Ibiden Co., Ltd. | 1724 |
24 |
| Mitsui Mining & Smelting Co., Ltd. | 1373 |
20 |
| International Business Machines Corporation | 60644 |
19 |
| Intel Corporation | 45621 |
19 |
| at & S Austria Technologie & Systemtechnik Aktiengesellschaft | 427 |
17 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
16 |
| HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. | 124 |
15 |
| LG Chem, Ltd. | 17205 |
13 |
| Shinko Electric Industries Co., Ltd. | 1186 |
13 |
| Unimicron Technology Corp. | 449 |
13 |
| Samsung Electro-mechanics Co., Ltd. | 4798 |
12 |
| Resonac Corporation | 2233 |
11 |
| Nitto Denko Corporation | 7879 |
10 |
| Taiwan Union Technology Corporation | 54 |
10 |
| Samsung Electronics Co., Ltd. | 131630 |
9 |
| Sumitomo Electric Industries, Ltd. | 14131 |
9 |
| Eastman Kodak Company | 3444 |
8 |
| Murata Manufacturing Co., Ltd. | 22355 |
8 |
| Other owners | 819 |